New collaboration with Electronic Design Chemnitz GmbH and i-ROM GmbH

We’re pleased to announce our collaboration with EDC Electronic Design Chemnitz GmbH. A key focus of our joint work is the systematic wafer-level characterization of MEMS devices after tape-out.

MEMS performance is often evaluated using individual chips from selected wafer positions. While this provides useful insights, it does not fully reflect process variation across the wafer.

Together with EDC, the same measurements can be applied across individual devices on the wafer using automated measurement routines, providing a much more complete picture of process variation.

For i-ROM, these measurements help show how manufacturing effects influence our customers’ MEMS designs after tape-out and where targeted design adjustments can improve reliability and help meet required specifications more consistently.

By combining i-ROM’s MEMS design and simulation expertise with EDC’s wafer-level measurement capabilities, we can provide customers a clearer basis for design decisions using real device behaviour.

Our collaboration also includes the DI-Meta-X project, part of the Chipdesign Germany network and funded by the German Federal Ministry for Research, Technology and Space (BMFTR).

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