The package interface of the i-ROM MODELBUILDER enables you to simulate precisely the influence of package warp on the performance of MEMS sensors and actuators. Temperature dependent bias-offset drift and sensitivity changes can be predicted before manufacturing.

Getting from an idea of what a next-generation accelerometer or gyroscope might look like to a manufacturable layout involves many complex simulation steps. Normally, many redesigns and a variety of software tools are used to arrive at a feasible layout that meets the target specifications and can be fabricated within manufacturing tolerances.